STEP 01

Schematic & BOM Review

DFM/DFT analysis, alternative component sourcing, cost-down proposals

STEP 02

Prototype Assembly

7-day turnaround from Gerber to assembled prototype on our SMT lines

STEP 03

EVT / DVT Testing

RF parametric, functional, environmental stress testing

STEP 04

Pre-Certification

FCC/CE/ISED pre-compliance. EMI scan, spurious emissions check

STEP 05

Mass Production

12 SMT lines, AOI, ICT, FCT. Ship within 4-6 weeks of PVT sign-off

// Core Manufacturing Services

Full electronics manufacturing services with IoT specialization

01

SMT Assembly

High-speed surface mount technology lines for IoT module production at scale.

  • 12 Fuji NXT III / Yamaha YSM20R lines
  • 0201 to 55x55mm component capability
  • BGA, QFN, LGA, WLCSP packages
  • 0201 metric placement accuracy
  • Throughput: 3.2M CPH aggregate
  • Nitrogen-reflow for RoHS/lead-free
  • 3D SPI (Solder Paste Inspection) on every line
  • 2D AOI (Automated Optical Inspection) post-reflow
02

DIP / Through-Hole

Wave soldering and selective soldering for connectors, headers, and mixed-technology boards.

  • 3 wave soldering lines (lead-free)
  • 2 selective soldering robots (ERSA)
  • Through-hole to SMT mixed assembly
  • Hand-soldering IPC-certified operators
  • Post-solder cleaning and inspection
03

RF Testing & Tuning

In-house RF lab for parametric testing and antenna matching. Critical for wireless IoT modules.

  • Rohde & Schwarz ZVL vector network analyzer
  • Keysight EXG/N5172B signal generator
  • Keysight N9020B MXA spectrum analyzer
  • OTA anechoic chamber (0.7~6 GHz)
  • Impedance matching & antenna tuning
  • TX power, RX sensitivity, EVM, spurious
  • Full test reports per module serial number
04

Conformal Coating

Environmental protection for modules deployed in harsh outdoor or industrial conditions.

  • 2 automated selective coating machines (PVA)
  • Acrylic, silicone, and urethane coatings
  • UV cure + thermal cure options
  • IPC-CC-830 compliant application
  • UV inspection station for coverage verification
  • IP54/IP65/IP67 validated assemblies
05

Box Build Assembly

Complete turnkey product assembly. PCB into enclosure, with accessories, packaging, and labeling.

  • 3 dedicated box-build assembly lines
  • Enclosure assembly, wiring harness
  • Firmware flashing & functional test
  • Custom labeling, barcoding, serialization
  • Retail-ready packaging & shrink wrap
  • Amazon FBA-compliant labeling
06

Quality Control

Multi-stage inspection and testing from IQC to OQC. Zero defects is the goal.

  • IQC: XRF RoHS screening, component verification
  • IPQC: Solder paste, reflow profile, first-article
  • AOI on every SMT line
  • ICT (In-Circuit Test) — Keysight 3070
  • FCT (Functional Circuit Test) — custom rigs
  • Burn-in / aging test (24-72 hrs per spec)
  • OQC AQL sampling per ISO 2859-1
12
SMT Lines
3.2M
CPH Throughput
0201
Min Component Size
0.3mm
BGA Pitch Capability

// Equipment Arsenal

Every line equipped with top-tier Japanese and German machines

Fuji NXT III
x6 lines
Yamaha YSM20R
x4 lines
Yamaha YSM10
x2 lines
Koh Young Zenith 3D SPI
x12 units
Koh Young Zenith 2D AOI
x12 units
Keysight 3070 ICT
x4 stations
R&S ZVL VNA
x3 units
Keysight N9020B MXA
x2 units
ERSA Versaflow 4/55
x2 units
PVA Delta 8 Coating
x2 units
Nordson DAGE Bond Tester
x1 unit
X-Rite XRF Analyzer
x2 units

// Certifications Matrix

Every process certified. Every shipment compliant.

ISO 9001
Quality Management
TUV Rheinland audited annually
ISO 14001
Environmental Mgmt
RoHS lead-free production
IPC-A-610
Class 3 Solder
Highest reliability standard
CE
EU Compliance
EMC / RED / LVD directives
FCC
USA Compliance
Part 15 / TCB filing support
RoHS 3
Material Compliance
REACH SVHC declarations

Ready to Build Your IoT Module?

Send us your BOM and Gerber files. We return a quote and DFM report within 24 hours.

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